International collaboration EU and Japan on semiconductors

Dijital Avrupa Programı · çağrı konusu DIGITAL-JU-CHIPS-2026-SG-JAPAN (DIGITAL-JU-CHIPS-2026-SG-JAPAN). Eylem türü: DIGITAL JU Simple Grants.

Expected Outcome:

Projects are expected to contribute to the following expected outcomes:

• Advanced heterogeneous integration, particularly in 2.5D and 3D packaging and integrated photonics, to support AI functionalities.
• Standardised chiplet interfaces, enabling interoperability and fostering a dynamic chiplet ecosystem

Expected outcomes should have direct and immediate impact on European industry.

Furthermore, proposed projects should demonstrate solutions across laboratory and pilot environments, with verification in semiconductor manufacturing use cases. The centre of gravity of envisaged work should address Technology Readiness Levels 5-7. Proposals also need to facilitate knowledge transfer and promote stakeholder engagement through industry workshops, publications, and networking events.

Kaynak: Avrupa Komisyonu Funding & Tenders Portal (otomatik aktarım; ayrıntı ve güncel koşullar için resmî sayfaya bakın).

"> Conditions

• Admissibility conditions: Proposal page limit and layout

described in Appendix 8 of Work Programme - Chips for Europe Initiative call document .

Proposal page limits and layout: described in Part B of the Application Form available in the Submission System.

• Eligible countries

described in Appendix 8 of Work Programme - Chips for Europe Initiative .

• Other eligibility conditions

Appendix 8 of Work Programme - Chips for Europe Initiative .

• …

Uygunluk: ülkenizin bu programa katılım durumunu ve ortaklık şartlarını resmî konu sayfasından teyit edin.